Molded Interconnect Devices (MIDs) are 3D injection-molded plastic components with integrated electronic circuitry—allowing mechanical and electrical functions to be combined into one compact part. They reduce size, weight, and assembly complexity. Demand is growing from sectors like automotive (zonal electronics, antennas), medical devices (wearables, implantables), consumer electronics, and telecom (5G antennas). Key tech-drivers include Laser Direct Structuring (LDS), two-shot molding, advances in additive methods, and miniaturization trends.