Step by Step Process of BGA Reballing
                     Step by Step Process of 
BGA Reballing
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Introduction
Reballing means changing all the Soldered Balls on Chip Ball Grid Array 
Circuit, there are a lot of different reasons why we need to reball a Chip. 
Reballing mainly runs on the computer, laptop, and game console 
motherboards, the reason behind this problem is the video graphics chip. It 
may be unbelievable, but your device's Video Chip is the most unfortunate 
chip to get the most broken soldered joints, and in most cases needs repair. 
In fact, as well as video chips, there are a lot of BGA circuit chips on the 
market, which need to be reballing when they break or fail.
Esanyog have solutions for all your BGA rework and repair needs. We have 
a state-of-the-art BGA rework system and staff of engineers and operators 
with deep knowledge and experience in the complex process of BGA 
rework. 
We offer a wide range of services including removal, replacement and 
recovery of BGA parts. Modification of circuit pattern design at X-ray 
inspection BGA site. Repair of lifted or missing BGA pads. Solder mask 
repair at BGA site
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Ball Grid Array, BGA 
rework
 It is not easy to rebuild a board containing BGA If you 
suspect that the BGA is defective, it is possible to remove 
the device. 
 This is achieved by locally heating the device to the 
underlying solder.
 In the BGA rework process, heating is often achieved. 
 This includes a jig with an infrared heater, a thermocouple 
for the monitor and a vacuum device to lift the package. 
 Care must be taken to heat and remove only the BGA. 
Contact information
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BGA Repair
 The removed BGA can be 
replaced with a new one. 
Occasionally, it may be possible 
to repair or repair a removed 
BGA. 
 This BGA repair may be an 
attractive proposition if the chip 
is known to be an expensive 
device that will operate once 
removed. 
 This BGA repair can be done 
using some small off-the-shelf 
solder balls that are 
manufactured and sold for this 
purpose. 
 Sanyog Electronics has extensive 
experience in both repairing and 
replacing failed BGA connections
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Steps for BGA Reballing
Step 1: Deball the Device
      Apply a water soluble paste flux using a syringe and apply a ball 
of the device with a gloved finger. Remove the solder ball using the 
appropriate blade tip or temperature setting based on the solder ball 
alloy. Use a soft-solder to ensure that the pad is flat and remove any 
remaining solder. Move the blade up and down without sweeping the 
bottom of the part to scratch the mask or lift the pad of the part.
Step 2: Clean Deball part
     Remove flux residue from the bottom of the Devar section using 
isopropyl alcohol and a non electrostatic induction wipe to clean the 
Deball part
Step 3: Apply water soluble paste flux
      Examine the device to make sure that the mask or lift pad is not 
scratched on the bottom of the device. Apply water soluble paste 
flux to the bottom of the part. Spread with a soft brush until the 
uniform thickness is at the bottom of the part.
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Step 4: Place the perform ball on top
Place the perform ball on top of a flat heat-resistant surface, 
such as a flat ceramic plate. Make sure that the performs are 
aligned with the device pattern. Make sure you have the correct 
solder alloy solder ball attached to the device.
Step 5: Carefully place the device on top of the preform
Carefully place the device on top of the BGA recall preform, 
making sure that the orientation of the pattern is correct.
Step 6: Square up the device to the perform
Use square brackets or other measures to "square" the preform 
to a BGA
Step 7: Reflux
Place the "sandwich" structure of the preform and equipment 
into a Reflux oven or other heat source. Make sure that the 
proper temperature setting is made.
Step 8: Wipe out Preform
While still warm, remove the preform from the device. Make sure 
that all balls have moved to the device. Please wipe with water 
and a soft brush. Re-inspect the scratches on the mask or lifted 
pad. www.esanyog.net
Step 9: Check Reballed equipment
Examine the reballed device by expanding it to the criteria you 
have in mind.
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Us 
 Shop No 15,Harshal Heights, 
Opp.Gavde Petrol Pump, Pimpri-
Chinchwad Link Rd, Pune, Maharashtra 
411033
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Thank You!
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