Phenol Formaldehyde Adhesives
                     Phenol Formaldehyde Adhesives & Laminates Industry future forecast indicates impressive growth 
rate 
Market Overview 
Phenol formaldehyde resins are synthetic polymers used to manufacture high-pressure laminates and 
adhesives. They are also used to manufacture plastics, molding compounds, and abrasives. Reaction of 
phenol and formaldehyde in the presence of an alkaline catalyst such as sodium hydroxide produces 
phenol formaldehyde. Phenol-formaldehyde resins are synthetic commercially available plastic resins. 
Paper base phenolic resin laminates are brittle due to high hardness and inexpensive and widely used in 
numerous applications such as wooden chipboard, construction, electrical equipment, and decorative 
articles. 
The global phenol formaldehyde adhesives and laminates market size is expected to witness potential 
gains in the future and register a significant CAGR of 5.1% over the forecast period (2019 - 2027). 
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Market Dynamics 
Increasing demand for phenol formaldehyde adhesives and laminates from end-use industries such as 
buildings & construction, automotive, and electronics is expected to boost growth of the global phenol 
formaldehyde adhesives and laminates market over the forecast period. Phenol formaldehyde laminates 
are used in manufacturing electrical components such as punch-through boards. 
Phenol formaldehyde adhesives are used in wooden chipboard for exterior wall appellations as they offer 
moisture resistance. In the construction industry, phenol formaldehyde resins are used as wood adhesives 
and glues for construction grade wood panels. Phenol formaldehyde adhesives offer high moisture 
resistance and superior water resistance. Phenol formaldehyde reacts with natural phenol-like lignin 
found in wood to enhance glue to wood bond and sets hard and rigid. Therefore, demand for phenol 
formaldehyde adhesives from the construction industry is also expected to boost the market growth over 
the forecast period.   
However, presence of cheaper alternatives is expected to hinder the market growth. Urea formaldehyde 
glue is cheaper compared to phenol formaldehyde adhesives. Moreover, phenol in phenolic adhesive 
formulations can be replaced with lignin. 
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Key players operating in the global phenol formaldehyde adhesives and laminates market include, 
Sumitomo Bakelite, BASF SE, Georgia Pacific, Mitsui Chemicals, and Kolon Industries Ltd. 
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