Wafer Inspection Equipment Market
                     Wafer Inspection Equipment Market SWOT Analysis by Top Key Players and Forecast Report to 2026 
Market Overview 
Wafer inspection equipment is fabrication system utilized for the detection of defects during the 
semiconductor wafer manufacturing processes. Increasing application of electronic semiconductor ICs in 
consumer electronics, industrial, automobile segments and related R&D activities is expected to drive 
the increased demands for the production. Requirement to maintain the quality of products and the 
client satisfaction is expected to remain the primary factor that would fuel the wafer inspection 
equipment market growth. 
Advanced wireless networking technologies such as 3G, 4G, Bluetooth, ZigBee, and wireless LAN have 
enabled fast and easy data transmission. Smartphones, tablets, wearables and sensors integrating these 
technologies have witnessed significant demand increase over the past few years. In conjunction with 
the demands for high level integration and development of new designs to provide support to multiple 
application on single platforms, intensive industry competition has led to increased demands for better 
quality and least defects in the semiconductor devices. Moreover, increasing demands for high 
performance chips for mission critical applications in industries and R&D activities will present 
considerable growth opportunities for the wafer inspection equipment market through the forecast 
period. 
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Market Dynammics 
Optical and E-beam are complementary technologies that perform distinct operations in the workflow. 
optical has fast throughputs and finds great applications in the end use. On the other hand E-beam helps 
in detection of smallest defects, however the throughputs are low. Owing to these features, it finds 
substantial applications in R&D activities. Increasing demands for advanced computing and processing 
has led to development of 3D finFETs, NAND and advanced DRAMs, which requires the tools to assess 
complex structures. Wafer assessment on the scales below 10 nm is extremely difficult, and in case of 
overlooking of the smallest error can impact the end use. This is expected to be major industry growth 
challenge over the next coming years. 
Asia Pacific is the largest hub for the electronic semiconductor manufacturing activities, driven by the 
extensive production demands specifically in the countries that include China, Taiwan, Japan and South 
Korea. Moreover, the region is also attributed with the presence of key electronic industry participants 
such as Samsung, Sony, Toshiba, Panasonic, among many others, which will help the region sustain its 
dominance over the next few years. 
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Key players in the wafer inspection equipment market include Applied Materials, Zeiss Global, Hermes 
Microvision (ASML), FEI (Thermo Fisher Scientific), KLA-Tencor, Hitachi High-Technologies, JEOL, Lasec 
Corporation, Lam Research, Nikon, Nanometrics, Planar Corporation, Tokyo Seimitsu, Rudolph 
Technologies, and Toray Engineering 
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