Solderability Test Equipment from Sasinno
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by sasinno
Solderability Test
Equipment from Sasinno
Manual operation consumes huge time and
requires undivided attention for a prolonged
period. Handling massive projects relying solely on
manual operation can be a costly mistake, you do
not wish to afford. Solderability testing is about
evaluating the solderability of wires, terminations
and other things (including lead) or an electronic
component.
What does the testing serve?
Opt for equipment that comes in complete
adherence with all current standards
observed in the industry. The testing helps
to avail of a way by which we can
determine the solderability of system
package terminations.
Popular Testing Methods
These are supposed to be paired with
some other surface employing PB-free
solder. Two popular methods are there
that are adopted to test the solderability
—Surface Mount Process Simulation Test
and Dip & Look Test.
Surface Mount Process Simulation Test
We perform surface mount simulation
testing via screen printing a specific
solder mixture (paste-like consistency)
onto the surface of a ceramic plate.
Dip and Look method
We perform dip and look solderability
testing by exposing the electronic
components to 0-8 hours of steam
conditioning constantly. Post this steam
conditioning phase, the terminations of the
components are immersed in the solder
mixture in a controlled way.
Important Features and Configurations to Look for
Look for suitable solderability test equipment
that can cater to your solderability testing
requirements in the best way possible.
Table-top or bench-top equipment features a
modular compact design that does not
consume extra space around unnecessarily.
The equipment should come installed with a
user-friendly interface in full English so that
the operator can easily manage its usage.
Sasinno
Bld 1, Hua Ke Bao Chuang, Industry Zone, Shi Da Road
Daling Shan Town,DongGuan, China
Zip code: 523825
Ph. no: 0769-85303739
Business mail: [email protected]
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